Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM: Fid-Bau Portal

Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM

Kim, S. S. / Kim, J. H. / Booh, S. W. / Kim, T.-G. / Lee, H. M.

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Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM

Kim, S. S. / Kim, J. H. / Booh, S. W. / Kim, T.-G. / Lee, H. M.

Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM

Kim, S. S. / Kim, J. H. / Booh, S. W. / Kim, T.-G. / Lee, H. M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructural Evolution of Joint Interface between Eutectic 80Au-20Sn Solder and UBM

Contributors:

Kim, S. S. (author) / Kim, J. H. (author) / Booh, S. W. (author) / Kim, T.-G. (author) / Lee, H. M. (author)

Published in:

Special Issue on Lead-Free Soldering in Electronics III ; 2400-2405

MATERIALS TRANSACTIONS ; 46

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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