Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging: Fid-Bau Portal

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

Yoon, J.-W. / Chun, H.-S. / Lee, H.-J. / Jung, S.-B.

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Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

Yoon, J.-W. / Chun, H.-S. / Lee, H.-J. / Jung, S.-B.

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

Yoon, J.-W. / Chun, H.-S. / Lee, H.-J. / Jung, S.-B.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

Title:

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

Contributors:

Yoon, J.-W. (author) / Chun, H.-S. (author) / Lee, H.-J. (author) / Jung, S.-B. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 2817-2824

Publication date:

2007-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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