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Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

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Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. / Chen, C. / Chou, T.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Contributors:

Chen, Y. H. (author) / Shao, T. L. (author) / Liu, P. C. (author) / Chen, C. (author) / Chou, T. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2432-2442

Publication date:

2005-01-01

Size:

11 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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