Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Delamination Growth in Ball Grid Array Electronic Package

    New search for: Yeh, M. K.
    New search for: Lee, I. S.
    New search for: Putra, I. S.
    New search for: Suharto, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Delamination Growth in Ball Grid Array Electronic Package

    New search for: Yeh, M. K.
    New search for: Lee, I. S.
    New search for: Putra, I. S.
    New search for: Suharto, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Delamination Growth in Ball Grid Array Electronic Package

    New search for: Yeh, M. K.
    New search for: Lee, I. S.
    New search for: Putra, I. S.
    New search for: Suharto, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Delamination Growth in Ball Grid Array Electronic Package

    Contributors:

    Yeh, M. K. (author) / Lee, I. S. (author) / Putra, I. S. / Suharto, D.

    Published in:

    Fracture and Strength of Solids VI ; 363-368

    KEY ENGINEERING MATERIALS ; 306/308

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

    Chang, K.-C. / Chiang, K.-N. | British Library Online Contents | 2006

    Stacked Package Delamination

    Lin, T. Y. | British Library Online Contents | 2003

    STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING

    LIANG Ying / HUANG ChunYue / YIN Rui et al. | DOAJ | 2016

    Free access

    Thermal Study of Enhanced Plastic Ball Grid Array Package with Flat Heat Spreader

    Huang, T. P. / Wu, G. H. | British Library Online Contents | 2007

    Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

    Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2007

    Back to top