Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model: Fid-Bau Portal

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

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Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Contributors:

Chang, K.-C. (author) / Chiang, K.-N. (author)

Published in:

JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 41 ; 19-30

Publication date:

2006-01-01

Size:

12 pages

ISSN:

0309-3247

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 624.176

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