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    Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

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    Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

    New search for: Yoon, J. W.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

    Contributors:

    Yoon, J. W. (author) / Jung, S. B. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 452/453 ; 46-54

    Publication date:

    2007-01-01

    Size:

    9 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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