Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Jen, Y. M. (Autor:in) / Chien, H. H. (Autor:in) / Lin, T. S. (Autor:in) / Huang, S. H. (Autor:in) / Putra, I. S. / Suharto, D.
01.01.2006
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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