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    Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

    New search for: Nam, H. W.
    New search for: Putra, I. S.
    New search for: Suharto, D.

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    Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

    New search for: Nam, H. W.
    New search for: Putra, I. S.
    New search for: Suharto, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

    New search for: Nam, H. W.
    New search for: Putra, I. S.
    New search for: Suharto, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Thermal Fatigue Life Prediction of ACF Bonding Flip Chip Packaging

    Contributors:

    Nam, H. W. (author) / Putra, I. S. / Suharto, D.

    Published in:

    Fracture and Strength of Solids VI ; 1049-1054

    KEY ENGINEERING MATERIALS ; 306/308

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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