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Flip Chip Bonding Flexible Circuit Devices

Pascual, D. N. / Callender, S.

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Flip Chip Bonding Flexible Circuit Devices

Pascual, D. N. / Callender, S.

Flip Chip Bonding Flexible Circuit Devices

Pascual, D. N. / Callender, S.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Flip Chip Bonding Flexible Circuit Devices

Contributors:

Pascual, D. N. (author) / Callender, S. (author)

Published in:

ADVANCED PACKAGING ; 13 ; 18-23

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

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