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Fatigue fracture of SnAgCu solder joints by microstructural modeling

Erinc, M. / Assman, T. M. / Schreurs, P. J. / Geers, M. G.

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Fatigue fracture of SnAgCu solder joints by microstructural modeling

Erinc, M. / Assman, T. M. / Schreurs, P. J. / Geers, M. G.

Fatigue fracture of SnAgCu solder joints by microstructural modeling

Erinc, M. / Assman, T. M. / Schreurs, P. J. / Geers, M. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fatigue fracture of SnAgCu solder joints by microstructural modeling

Contributors:

Erinc, M. (author) / Assman, T. M. (author) / Schreurs, P. J. (author) / Geers, M. G. (author)

Published in:

INTERNATIONAL JOURNAL OF FRACTURE ; 152 ; 37-49

Publication date:

2008-01-01

Size:

13 pages

ISSN:

0376-9429

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

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