A platform for research: civil engineering, architecture and urbanism
Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
Kumar, K. M. (author) / Kripesh, V. (author) / Shen, L. (author) / Zeng, K. (author) / Tay, A. A. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 423 ; 57-63
2006-01-01
7 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Nanoindentation of lead-free solders in microelectronic packaging
British Library Online Contents | 2007
|Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation
British Library Online Contents | 2006
|Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
British Library Online Contents | 2008
|British Library Online Contents | 2011
|Electrochemical corrosion study of Pb-free solders
British Library Online Contents | 2006
|