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    Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

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    New search for: Xie, X.
    New search for: Lu, C.

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    Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

    New search for: Xia, Y.
    New search for: Xie, X.
    New search for: Lu, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

    New search for: Xia, Y.
    New search for: Xie, X.
    New search for: Lu, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

    Contributors:

    Xia, Y. (author) / Xie, X. (author) / Lu, C. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 41 ; 2359-2364

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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