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    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    New search for: Gao, F.
    New search for: Cheng, F.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.

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    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    New search for: Gao, F.
    New search for: Cheng, F.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    New search for: Gao, F.
    New search for: Cheng, F.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

    Contributors:

    Gao, F. (author) / Cheng, F. (author) / Nishikawa, H. (author) / Takemoto, T. (author)

    Published in:

    MATERIALS LETTERS ; 62 ; 2257-2259

    Publication date:

    2008-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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