A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Microstructure of Solder Joint Interconnect in Used Mobile Phone
Microstructure of Solder Joint Interconnect in Used Mobile Phone
Microstructure of Solder Joint Interconnect in Used Mobile Phone
Shahdan, S. N. (author) / Jalar, A. (author) / Hamid, M. A. A. (author)
MATERIALS SCIENCE FORUM ; 517 ; 123-128
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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