Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint: Fid-Bau Portal

Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, W. K. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, W. K. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Choi, W. K. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

Contributors:

Choi, W. K. (author) / Kim, J. H. (author) / Jeong, S. W. (author) / Lee, H. M. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 43-51

Publication date:

2002-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Kumar, A. / Chen, Z. | British Library Online Contents | 2006

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W. / Kim, S. W. / Jung, S. B. | British Library Online Contents | 2005

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

Yeung, B. / Jang, J. W. | British Library Online Contents | 2002

Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys

Choi, J.-W. / Cha, H.-S. / Oh, T.-S. | British Library Online Contents | 2002