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    Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films

    New search for: Menzel, S.
    New search for: Strehle, S.
    New search for: Wendrock, H.
    New search for: Wetzig, K.

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    Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films

    New search for: Menzel, S.
    New search for: Strehle, S.
    New search for: Wendrock, H.
    New search for: Wetzig, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films

    New search for: Menzel, S.
    New search for: Strehle, S.
    New search for: Wendrock, H.
    New search for: Wetzig, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films

    Contributors:

    Menzel, S. (author) / Strehle, S. (author) / Wendrock, H. (author) / Wetzig, K. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 252 ; 211-214

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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