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The mechanical properties of freestanding electroplated Cu thin films

Xiang, Y. / Tsui, T. Y. / Vlassak, J. J.

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The mechanical properties of freestanding electroplated Cu thin films

Xiang, Y. / Tsui, T. Y. / Vlassak, J. J.

The mechanical properties of freestanding electroplated Cu thin films

Xiang, Y. / Tsui, T. Y. / Vlassak, J. J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

The mechanical properties of freestanding electroplated Cu thin films

Contributors:

Xiang, Y. (author) / Tsui, T. Y. (author) / Vlassak, J. J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 1607-1618

Publication date:

2006-01-01

Size:

12 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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