Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate: Fid-Bau Portal

Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chang, T. C. / Chou, S. M. / Hon, M. H. / Wang, M. C.

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Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chang, T. C. / Chou, S. M. / Hon, M. H. / Wang, M. C.

Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chang, T. C. / Chou, S. M. / Hon, M. H. / Wang, M. C.

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Check availability in my library

Order at Subito €

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Document information

Title:

Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Contributors:

Chang, T. C. (author) / Chou, S. M. (author) / Hon, M. H. (author) / Wang, M. C. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 429 ; 36-42

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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