Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate: Fid-Bau Portal

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chen, W. / Xue, S. / Wang, H. / Wang, J. / Han, Z.

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Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chen, W. / Xue, S. / Wang, H. / Wang, J. / Han, Z.

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chen, W. / Xue, S. / Wang, H. / Wang, J. / Han, Z.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Contributors:

Chen, W. (author) / Xue, S. (author) / Wang, H. (author) / Wang, J. (author) / Han, Z. (author)

Published in:

RARE METALS -BEIJING- ENGLISH EDITION ; 28 ; 656-660

Publication date:

2009-01-01

Size:

5 pages

ISSN:

1001-0521

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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