Microstructure evolution in a Pb-free solder alloy during mechanical fatigue: Fid-Bau Portal

Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Matin, M. A. / Vellinga, W. P. / Geers, M. G.

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Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Matin, M. A. / Vellinga, W. P. / Geers, M. G.

Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Matin, M. A. / Vellinga, W. P. / Geers, M. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Contributors:

Matin, M. A. (author) / Vellinga, W. P. (author) / Geers, M. G. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 431 ; 166-174

Publication date:

2006-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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