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Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Effect of Compatibility Between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Chaware, R. (Autor:in) / Stiborek, L. (Autor:in) / Libres, J. (Autor:in) / Marquez, M. (Autor:in) / Odegard, C. (Autor:in) / Cowens, M. (Autor:in) / Venkateswaran, M. (Autor:in)
ADVANCING MICROELECTRONICS ; 33 ; 10-19
01.01.2006
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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