Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
Choa, S. H. (Autor:in) / Aliabadi, M. H. / Li, Q. / Li, L. / Buchholz, F.-G.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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| British Library Online Contents | 2002
Trends in Wafer-Level Packaging of MEMS MEMS Packaging Solutions
| British Library Online Contents | 2004
Low-Cost Wafer-Level Vacuum Packaging for MEMS
| British Library Online Contents | 2003
Wafer-level Packaging Perspectives
| British Library Online Contents | 2002
Wafer-scale Encapsulation: Controlling MEMS Packaging Costs
| British Library Online Contents | 2002