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    Microwave Dielectric Loss Characterization of Silicon Carbide Wafers

    New search for: Bogart, T.
    New search for: Everson, B.
    New search for: Gamble, R. D.
    New search for: Oslosky, E.
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    Microwave Dielectric Loss Characterization of Silicon Carbide Wafers

    New search for: Bogart, T.
    New search for: Everson, B.
    New search for: Gamble, R. D.
    New search for: Oslosky, E.
    New search for: Synder, D. W.
    New search for: Furman, E.
    New search for: Perini, S.
    New search for: Lanagan, M.
    New search for: Devaty, R. P.
    New search for: Larkin, D. J.
    New search for: Saddow, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microwave Dielectric Loss Characterization of Silicon Carbide Wafers

    New search for: Bogart, T.
    New search for: Everson, B.
    New search for: Gamble, R. D.
    New search for: Oslosky, E.
    New search for: Synder, D. W.
    New search for: Furman, E.
    New search for: Perini, S.
    New search for: Lanagan, M.
    New search for: Devaty, R. P.
    New search for: Larkin, D. J.
    New search for: Saddow, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Microwave Dielectric Loss Characterization of Silicon Carbide Wafers

    Contributors:

    Bogart, T. (author) / Everson, B. (author) / Gamble, R. D. (author) / Oslosky, E. (author) / Synder, D. W. (author) / Furman, E. (author) / Perini, S. (author) / Lanagan, M. (author) / Devaty, R. P. / Larkin, D. J.

    Published in:

    Silicon Carbide and Related Materials - 2005 ; 733-738

    MATERIALS SCIENCE FORUM ; 527/529

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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