Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS: Fid-Bau Portal

Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS

Lee, W. J. / Lee, Y. S. / Rha, S. K. / Lee, Y. J. / Lim, K. Y. / Chung, Y. D. / Whang, C. N.

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Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS

Lee, W. J. / Lee, Y. S. / Rha, S. K. / Lee, Y. J. / Lim, K. Y. / Chung, Y. D. / Whang, C. N.

Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS

Lee, W. J. / Lee, Y. S. / Rha, S. K. / Lee, Y. J. / Lim, K. Y. / Chung, Y. D. / Whang, C. N.

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Document information

Title:

Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS

Contributors:

Lee, W. J. (author) / Lee, Y. S. (author) / Rha, S. K. (author) / Lee, Y. J. (author) / Lim, K. Y. (author) / Chung, Y. D. (author) / Whang, C. N. (author)

Published in:

APPLIED SURFACE SCIENCE ; 205 ; 128-136

Publication date:

2003-01-01

Size:

9 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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