Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
Kim, D. G. (Autor:in) / Kim, J. W. (Autor:in) / Ha, S. S. (Autor:in) / Koo, J. M. (Autor:in) / Noh, B. I. (Autor:in) / Jung, S. B. (Autor:in) / Kim, H. / Hojo, J. / Lee, S. W.
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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