Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Microstructural evolution of gold–aluminum wire-bonds

    New search for: Karpel, A.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Microstructural evolution of gold–aluminum wire-bonds

    New search for: Karpel, A.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructural evolution of gold–aluminum wire-bonds

    New search for: Karpel, A.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructural evolution of gold–aluminum wire-bonds

    Contributors:

    Karpel, A. (author) / Gur, G. (author) / Atzmon, Z. (author) / Kaplan, W. D. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 42 ; 2347-2357

    Publication date:

    2007-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    Ji, H. / Li, M. / Wang, C. et al. | British Library Online Contents | 2007

    Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

    Drozdov, M. / Gur, G. / Atzmon, Z. et al. | British Library Online Contents | 2008

    TEM microstructural analysis of As-Bonded Al–Au wire-bonds

    Karpel, A. / Gur, G. / Atzmon, Z. et al. | British Library Online Contents | 2007

    Nanoindentation and microstructural evolution of polycrystalline gold

    Ma, J.B. / Zikry, M.A. | British Library Online Contents | 2009

    Microstructural evolution of copper clad steel bimetallic wire

    Sasaki, T. T. / Barkey, M. / Thompson, G. B. et al. | British Library Online Contents | 2011

    Back to top