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TEM microstructural analysis of As-Bonded Al–Au wire-bonds

Karpel, A. / Gur, G. / Atzmon, Z. / Kaplan, W. D.

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TEM microstructural analysis of As-Bonded Al–Au wire-bonds

Karpel, A. / Gur, G. / Atzmon, Z. / Kaplan, W. D.

TEM microstructural analysis of As-Bonded Al–Au wire-bonds

Karpel, A. / Gur, G. / Atzmon, Z. / Kaplan, W. D.

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Access via TIB

Check availability in my library

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Document information

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Document information

Title:

TEM microstructural analysis of As-Bonded Al–Au wire-bonds

Contributors:

Karpel, A. (author) / Gur, G. (author) / Atzmon, Z. (author) / Kaplan, W. D. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 42 ; 2334-2346

Publication date:

2007-01-01

Size:

13 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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