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    Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

    New search for: Drozdov, M.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

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    Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

    New search for: Drozdov, M.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

    New search for: Drozdov, M.
    New search for: Gur, G.
    New search for: Atzmon, Z.
    New search for: Kaplan, W. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing

    Contributors:

    Drozdov, M. (author) / Gur, G. (author) / Atzmon, Z. (author) / Kaplan, W. D. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 43 ; 6038-6048

    Publication date:

    2008-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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