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    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    New search for: Ji, H.
    New search for: Li, M.
    New search for: Wang, C.
    New search for: Bang, H. S.

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    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    New search for: Ji, H.
    New search for: Li, M.
    New search for: Wang, C.
    New search for: Bang, H. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    New search for: Ji, H.
    New search for: Li, M.
    New search for: Wang, C.
    New search for: Bang, H. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging

    Contributors:

    Ji, H. (author) / Li, M. (author) / Wang, C. (author) / Bang, H. S. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 447 ; 111-118

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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