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Junction temperature and reliability of high-power flip-chip light emitting diodes
Junction temperature and reliability of high-power flip-chip light emitting diodes
Junction temperature and reliability of high-power flip-chip light emitting diodes
Chen, Z. Z. (author) / Liu, P. (author) / Qi, S. L. (author) / Lin, L. (author) / Pan, H. P. (author) / Qin, Z. X. (author) / Yu, T. J. (author) / He, Z. K. (author) / Zhang, G. Y. (author)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 10 ; 206-210
2007-01-01
5 pages
Article (Journal)
English
DDC:
621.38152
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