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    Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling

    New search for: Sun, Z.
    New search for: Benabou, L.
    New search for: Dahoo, P. R.

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    Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling

    New search for: Sun, Z.
    New search for: Benabou, L.
    New search for: Dahoo, P. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling

    New search for: Sun, Z.
    New search for: Benabou, L.
    New search for: Dahoo, P. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling

    Contributors:

    Sun, Z. (author) / Benabou, L. (author) / Dahoo, P. R. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 107 ; 48-60

    Publication date:

    2013-01-01

    Size:

    13 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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