A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Sham, M. L. (author) / Kim, J. K. (author) / Park, J. H. (author)
COMPUTATIONAL MATERIALS SCIENCE ; 40 ; 81-89
2007-01-01
9 pages
Article (Journal)
English
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