Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin
Sham, M. L. (Autor:in) / Kim, J. K. (Autor:in) / Park, J. H. (Autor:in)
COMPUTATIONAL MATERIALS SCIENCE ; 40 ; 81-89
01.01.2007
9 pages
Aufsatz (Zeitschrift)
Englisch
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