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    Prevention of Dicing-Induced Damage in Semiconductor Wafers

    New search for: Lee, S. M.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

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    Prevention of Dicing-Induced Damage in Semiconductor Wafers

    New search for: Lee, S. M.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Prevention of Dicing-Induced Damage in Semiconductor Wafers

    New search for: Lee, S. M.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Prevention of Dicing-Induced Damage in Semiconductor Wafers

    Contributors:

    Lee, S. M. (author) / Nam, S. W. / Chang, Y. W. / Lee, S. B. / Kim, N. J.

    Published in:

    The Mechanical Behavior of Materials X ; 485-488

    KEY ENGINEERING MATERIALS ; 345/346

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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