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In situ examinations of mechanical dicing-induced damage in semiconductor wafers

Lee, S.-M.

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In situ examinations of mechanical dicing-induced damage in semiconductor wafers

Lee, S.-M.

In situ examinations of mechanical dicing-induced damage in semiconductor wafers

Lee, S.-M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

In situ examinations of mechanical dicing-induced damage in semiconductor wafers

Contributors:

Lee, S.-M. (author)

Published in:

SURFACE REVIEW AND LETTERS ; 17 ; 317-321

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0218-625X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 530.417

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