Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

    New search for: Liu, C.
    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Thomson, R. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

    New search for: Liu, C.
    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Thomson, R. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

    New search for: Liu, C.
    New search for: Huang, Z.
    New search for: Conway, P. P.
    New search for: Thomson, R. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

    Contributors:

    Liu, C. (author) / Huang, Z. (author) / Conway, P. P. (author) / Thomson, R. C. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 42 ; 4076-4086

    Publication date:

    2007-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Recrystallization behaviour of SnAgCu solder joints

    Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

    Interfacial Reaction between SnAgCu Solder and Cu Substrate and Reliability Evaluation

    Yanghua, X. / Xiaming, X. / Junling, C. | British Library Online Contents | 2005

    Solderability of Electrodeposited Fe-Ni Alloys with Eutectic SnAgCu Solder

    Guo, J. / Zhang, L. / Xian, A. et al. | British Library Online Contents | 2007

    Mechanical and microstructural properties of SnAgCu solder joints

    Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. et al. | British Library Online Contents | 2006

    Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator

    Xue, J. / Zhao, M.-q. / Li, T. | British Library Online Contents | 2010

    Back to top