Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys
Liu, C. (Autor:in) / Huang, Z. (Autor:in) / Conway, P. P. (Autor:in) / Thomson, R. C. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 42 ; 4076-4086
01.01.2007
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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