Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization: Fid-Bau Portal

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. / Alam, M. O. / Guan, J. F.

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Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. / Alam, M. O. / Guan, J. F.

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. / Alam, M. O. / Guan, J. F.

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Title:

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Contributors:

Zhong, W. H. (author) / Chan, Y. C. (author) / Wu, B. Y. (author) / Alam, M. O. (author) / Guan, J. F. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 42 ; 5239-5247

Publication date:

2007-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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