Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow: Fid-Bau Portal

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Contributors:

Shao, T. L. (author) / Chen, T. S. (author) / Huang, Y. M. (author) / Chen, C. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 3654-3664

Publication date:

2004-01-01

Size:

11 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. et al. | British Library Online Contents | 2007

Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. et al. | British Library Online Contents | 2010

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. et al. | British Library Online Contents | 2005

Microstructure evolution during electromigration in eutectic SnPb solder bumps

Lu, C. M. / Shao, T. L. / Yang, C. J. et al. | British Library Online Contents | 2004

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003