Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization: Fid-Bau Portal

Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization

Wang, Y. / Zhao, C. / Song, Z. / Cao, F. / Yang, D.

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Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization

Wang, Y. / Zhao, C. / Song, Z. / Cao, F. / Yang, D.

Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization

Wang, Y. / Zhao, C. / Song, Z. / Cao, F. / Yang, D.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of substrate bias voltages on the diffusion barrier properties of Zr-N films in Cu metallization

Contributors:

Wang, Y. (author) / Zhao, C. (author) / Song, Z. (author) / Cao, F. (author) / Yang, D. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 8858-8862

Publication date:

2007-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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