Ti-diffusion barrier in Cu-based metallization

Braud, F. / Torres, J. / Palleau, J. et al. | British Library Online Contents | 1996

Tribological Properties of Hydrogenated Amorphous Carbon (a-C:H) Films on Aluminium Alloy Substrate under Different Substrate Bias Voltages

Gui, X. / Su, Y.Y. / Li, S.Y. et al. | British Library Online Contents | 2011

Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization

Tripathi, C. C. / Kumar, M. / Kumar, D. | British Library Online Contents | 2009

Structure and properties of TiAlLaN films deposited at various bias voltages

Du, H. / Xiong, J. / Zhao, H. et al. | British Library Online Contents | 2014

Tribological properties and adhesive strength of DLC coatings prepared under different substrate bias voltages

Sheeja, D. / Tay, B. K. / Lau, S. P. et al. | British Library Online Contents | 2001