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    Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

    New search for: Liu, C.-Y.
    New search for: Chen, Y.-R.
    New search for: Li, W.-L.
    New search for: Hon, M.-H.
    New search for: Wang, M.-C.

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    Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

    New search for: Liu, C.-Y.
    New search for: Chen, Y.-R.
    New search for: Li, W.-L.
    New search for: Hon, M.-H.
    New search for: Wang, M.-C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

    New search for: Liu, C.-Y.
    New search for: Chen, Y.-R.
    New search for: Li, W.-L.
    New search for: Hon, M.-H.
    New search for: Wang, M.-C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

    Contributors:

    Liu, C.-Y. (author) / Chen, Y.-R. (author) / Li, W.-L. (author) / Hon, M.-H. (author) / Wang, M.-C. (author)

    Published in:

    Crystallographic Orientation Distribution and Related Properties in Advanced Materials ; 2133-2138

    MATERIALS TRANSACTIONS ; 48

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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