Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface: Fid-Bau Portal

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Liu, C.-Y. / Chen, Y.-R. / Li, W.-L. / Hon, M.-H. / Wang, M.-C.

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Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Liu, C.-Y. / Chen, Y.-R. / Li, W.-L. / Hon, M.-H. / Wang, M.-C.

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Liu, C.-Y. / Chen, Y.-R. / Li, W.-L. / Hon, M.-H. / Wang, M.-C.

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Titel:

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Beteiligte:

Liu, C.-Y. (Autor:in) / Chen, Y.-R. (Autor:in) / Li, W.-L. (Autor:in) / Hon, M.-H. (Autor:in) / Wang, M.-C. (Autor:in)

Erschienen in:

Crystallographic Orientation Distribution and Related Properties in Advanced Materials ; 2133-2138

MATERIALS TRANSACTIONS ; 48

Erscheinungsdatum:

01.01.2007

Format / Umfang:

6 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

El-Daly, A.A. / El-Taher, A.M. / Gouda, S. | Elsevier | 2014

Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder

Chang, T. C. / Hon, M. H. / Wang, M. C. | British Library Online Contents | 2003

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

Fu, Y. / Zhang, Q. / Sun, F. et al. | British Library Online Contents | 2007

Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

Xia, Y. / Xie, X. / Lu, C. | British Library Online Contents | 2006

Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

Gao, F. / Cheng, F. / Nishikawa, H. et al. | British Library Online Contents | 2008

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