Modeling effect of chemical-mechanical synergy on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / Jiang, J. et al. | British Library Online Contents | 2008

Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003

A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species

Zhao, Y. / Chang, L. / Kim, S. H. | British Library Online Contents | 2003

Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004

Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / An, W. et al. | British Library Online Contents | 2010