Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing: Fid-Bau Portal

Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / An, W. / Ni, Z. / Wang, J.

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Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / An, W. / Ni, Z. / Wang, J.

Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / An, W. / Ni, Z. / Wang, J.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Contributors:

Wang, Y. (author) / Zhao, Y. (author) / An, W. (author) / Ni, Z. (author) / Wang, J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 257 ; 249-253

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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On material removal capability of abrasive particle in polishing process

Su, Y.-T. / Hung, T.-C. / Tsai, C.-M. | British Library Online Contents | 2003

Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003