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    Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

    New search for: Song, J.-M.
    New search for: Liu, Y.-R.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

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    Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

    New search for: Song, J.-M.
    New search for: Liu, Y.-R.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

    New search for: Song, J.-M.
    New search for: Liu, Y.-R.
    New search for: Su, C.-W.
    New search for: Lai, Y.-S.
    New search for: Chiu, Y.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

    Contributors:

    Song, J.-M. (author) / Liu, Y.-R. (author) / Su, C.-W. (author) / Lai, Y.-S. (author) / Chiu, Y.-T. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2545-2554

    Publication date:

    2008-01-01

    Size:

    10 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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