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    Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    New search for: Fu, S.
    New search for: Mei, Y.
    New search for: Lu, G. Q.
    New search for: Li, X.
    New search for: Chen, G.
    New search for: Chen, X.

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    Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    New search for: Fu, S.
    New search for: Mei, Y.
    New search for: Lu, G. Q.
    New search for: Li, X.
    New search for: Chen, G.
    New search for: Chen, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    New search for: Fu, S.
    New search for: Mei, Y.
    New search for: Lu, G. Q.
    New search for: Li, X.
    New search for: Chen, G.
    New search for: Chen, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

    Contributors:

    Fu, S. (author) / Mei, Y. (author) / Lu, G. Q. (author) / Li, X. (author) / Chen, G. (author) / Chen, X. (author)

    Published in:

    MATERIALS LETTERS ; 128 ; 42-45

    Publication date:

    2014-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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