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    Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

    New search for: Shohji, I.
    New search for: Osawa, T.
    New search for: Okashita, T.
    New search for: Watanabe, H.

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    Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

    New search for: Shohji, I.
    New search for: Osawa, T.
    New search for: Okashita, T.
    New search for: Watanabe, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

    New search for: Shohji, I.
    New search for: Osawa, T.
    New search for: Okashita, T.
    New search for: Watanabe, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

    Contributors:

    Shohji, I. (author) / Osawa, T. (author) / Okashita, T. (author) / Watanabe, H. (author)

    Published in:

    KEY ENGINEERING MATERIALS ; 385/387 ; 745-748

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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