Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Investigation of the Mechanical Properties of Lead-Free Solder Materials

    New search for: Otahal, A.
    New search for: Adamek, M.
    New search for: Jansa, V.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Investigation of the Mechanical Properties of Lead-Free Solder Materials

    New search for: Otahal, A.
    New search for: Adamek, M.
    New search for: Jansa, V.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Investigation of the Mechanical Properties of Lead-Free Solder Materials

    New search for: Otahal, A.
    New search for: Adamek, M.
    New search for: Jansa, V.
    New search for: Szendiuch, I.
    New search for: Sandera, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Investigation of the Mechanical Properties of Lead-Free Solder Materials

    Contributors:

    Otahal, A. (author) / Adamek, M. (author) / Jansa, V. (author) / Szendiuch, I. (author) / Sandera, P.

    Published in:

    Materials Structure & Micromechanics of Fracture VII ; 453-456

    KEY ENGINEERING MATERIALS ; 592/593

    Publication date:

    2014-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder

    Mohd Salleh, M. A. / Bakri, A. M. / Zan@Hazizi, M. H. et al. | British Library Online Contents | 2012

    Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder

    Shimokawa, H. / Soga, T. / Serizawa, K. | British Library Online Contents | 2002

    Lead-free Solder Wafer Bumping

    Dimock, F. / Mattson, K. | British Library Online Contents | 2004

    Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

    Kar, A. / Ghosh, M. / Ghosh, R. N. et al. | British Library Online Contents | 2008

    Thermomigration in lead-free solder joints

    Abdulhamid, Mohd F. / Li, Shidong / Basaran, Cemal | British Library Online Contents | 2008

    Back to top