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    Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

    New search for: Yoon, J. W.
    New search for: Chun, H. S.
    New search for: Jung, S. B.

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    Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

    New search for: Yoon, J. W.
    New search for: Chun, H. S.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

    New search for: Yoon, J. W.
    New search for: Chun, H. S.
    New search for: Jung, S. B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

    Contributors:

    Yoon, J. W. (author) / Chun, H. S. (author) / Jung, S. B. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 473 ; 119-125

    Publication date:

    2008-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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